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题名/责任者:

Electronic assembly fabrication : chips, circuit boards, packages, and components / Charles A. Harper, editor-in-chief.

出版发行项:

New York : McGraw-Hill, c2002.

ISBN:

0071378820 (alk. paper)

载体形态项:

xv, 672 p. : ill. ; 24 cm.

丛编题名:

McGraw-Hill professional engineering.

丛编题名:

Electronic packaging and interconnection series.

附加个人名称:

Harper, Charles A.

论题主题:

Electronic apparatus and appliances-Design and construction.

中图法分类号:

TP391.7

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