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MARC状态:审校 文献类型:西文图书 浏览次数:56

题名/责任者:
Understanding MEMS : principles and applications / Luis Casta?er.
出版发行项:
Chichester, UK ; Hoboken, New Jersey : John Wiley & Sons, 2016.
ISBN:
9781119055426 (cloth)
载体形态项:
xiv, 314 pages : illustrations ; 25 cm
其他载体形态:
Online version: Casta?er, Luis, author. Understanding MEMS Chichester, UK ; Hoboken, New Jersey : John Wiley & Sons, 2015 9781119055433
个人责任者:
Casta?er, Luis, author.
论题主题:
Microelectromechanical systems.
中图法分类号:
TH-39
书目附注:
Includes bibliographical references (p. [307]-309) and index.
内容附注:
Scaling of forces -- Elasticity -- Bending of microstructures -- Piezoresistance and piezoelectricity -- Electrostatic driving and sensing -- Resonators -- Microfluidics and electrokinetics -- Thermal devices -- Fabrication.
摘要附注:
The continued advancement of MEMS (micro-electro-mechanical systems) complexity, performance, commercial exploitation and market size requires an ever-expanding graduate population with state-of-the-art expertise.Understanding MEMS: Principles and Applications provides a comprehensive introduction to this complex and multidisciplinary technology that is accessible to senior undergraduate and graduate students from a range of engineering and physical sciences backgrounds.Fully self-contained, this textbook is designed to help students grasp the key principles and operation of MEMS devices and to inspire advanced study or a career in this field.Moreover, with the increasing application areas, product categories and functionality of MEMS, industry professionals will also benefit from this consolidated overview, source of relevant equations and extensive solutions to problems.Key features:Details the fundamentals of MEMS, enabling readers to understand the basic governing equations and know how they apply at the micron scale.Strong pedagogical emphasis enabling students to understand the fundamentals of MEMS devices.Self-contained study aid featuring problems and solutions.Book companion website hosts Matlab and PSpice codes and viewgraphs.--Amazon.com.
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