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西文图书1.Characterization in compound semiconductor processing = 化合物半导体加工中的表征 / TN304.2/M478
馆藏复本:2
可借复本:1 [editors], Gary E. McGuire, Yale E. Strausser.
Harbin Institute of Technology Press, 2014.
(0) 馆藏 -
西文图书2.Characterization of integrated circuit packaging materials = 集成电路封装材料的表征 / TN405/M824
馆藏复本:2
可借复本:1 [editors], Thomas M.Moore, Robert G.McKenna.
Harbin Institute of Technology Press, 2014.
(0) 馆藏 -
西文图书3.Characterization of polymers = 聚合物的表征 / O63/C552
馆藏复本:2
可借复本:1 [editors], Ned J.Chou ... [et al.].
Harbin institute of technology press, 2014.
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