机读格式显示(MARC)

• 000 01034cam a2200289 a 4500

• 001 0000506649

• 003 SCNU

• 005 20141105102000.0

• 008 140124r20142010cc a b 001 0 eng d

• 020 __ |a 9787560342825

• 040 __ |a PUL |c PUL |d HEU

• 050 _4 |a TA177.4 |b .S85

• 082 04 |a 658.15 |2 21

• 093 __ |a TN405 |2 5

• 099 __ |a CAL 022014026706

• 245 00 |a Characterization of integrated circuit packaging materials = |b 集成电路封装材料的表征 / |c [editors], Thomas M.Moore, Robert G.McKenna.

• 246 31 |a 集成电路封装材料的表征

• 260 __ |a Harbin : |b Harbin Institute of Technology Press, |c 2014.

• 300 __ |a xx, 274 p. : |b ill. ; |c 23 cm.

• 490 0_ |a Materials characterization serise = |a 材料表征原版系列丛书

• 504 __ |a Includes bibliographical references and index.

• 534 __ |p Reprint. Originally published: |c New York : Momentum Press, 2010. |z 9781606501870.

• 650 _0 |a Integrated circuit technology.

• 700 1_ |a Moore Thomas M.

• 700 1_ |a McKenna, Robert G.

• 920 __ |a 242430 |z 2

• 950 __ |a SCNU |f TN405/M824