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• 245 00 |a Area array package design : |b techniques in high-density electronics / |c Ken Gilleo, ed.

• 260 __ |a New York : |b McGraw-Hill, |c c2004.

• 300 __ |a xii, 204 p. : |b ill. ; |c 25 cm.

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• 500 __ |a Includes index.

• 650 _0 |a Electronic packaging |x Design.

• 700 1_ |a Gilleo, Ken.

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