机读格式显示(MARC)
- 000 01111nam a2200289 i 4500
- 008 220922s2021 cc a b 001 0 eng d
- 020 __ |a 9787122394842 |q (hardback)
- 040 __ |a TJDX |b eng |c TJDX |e rda
- 099 __ |a CAL 022022065330
- 100 1_ |a Ma, Shenglin |9 (马盛林), |e author.
- 245 10 |a TSV 3D RF integration : |b HR-Si interposer technology / |c Shenglin Ma, Yufeng Jin = TSV三维射频集成 : 高阻硅转接版技术 / 马盛林, 金玉丰著.
- 246 31 |a TSV三维射频集成 : |b 高阻硅转接版技术
- 264 _1 |a 北京 : |b 化学工业出版社, |c 2021.
- 300 __ |a xvii, 273 pages : |b illustrations ; |c 25 cm.
- 336 __ |a text |b txt |2 rdacontent
- 337 __ |a unmediated |b n |2 rdamedia
- 338 __ |a volume |b nc |2 rdacarrier
- 490 0_ |a Series on advanced electronic packaging technology and key materials = |a 先进电子封装技术与关键材料丛书
- 504 __ |a Includes bibliographical references and index.
- 650 _0 |a Microlithography |x Industrial applications.
- 700 1_ |a Jin, Yufeng |9 (金玉丰), |e author.
- 950 __ |a SCNU |f TN405/M111