机读格式显示(MARC)

• 000 01060cam a2200325 a 4500

• 001 0000620213

• 003 SCNU

• 005 20180305152600.0

• 008 170522s2017 cc a b 001 0 eng d

• 020 __ |a 9787030522726

• 040 __ |a SDU |c SDU |d JLU

• 041 0_ |a eng |b chi

• 093 __ |a TN4 |2 5

• 093 __ |a TN405 |2 5

• 099 __ |a CAL 022017065198

• 100 1_ |a Lau, John H. |9 (刘汉诚)

• 245 10 |a 3D IC integration and packaging = |b 集成电路三维系统集成与封装工艺 / |c (美) John H. Lau著 ; 曹立强, 刘丰满, 王启东中文导读.

• 246 31 |a 集成电路三维系统集成与封装工艺

• 260 __ |a 北京 : |b 科学出版社, |c 2017.

• 300 __ |a xlii, 458 p. : |b ill. ; |c 24 cm.

• 490 0_ |a 信息科学技术学术著作丛书

• 504 __ |a Includes bibliographical references and index.

• 546 __ |a With preface and contents in Chinese.

• 650 _0 |a Three-dimensional integrated circuits.

• 650 _0 |a Microelectronic packaging.

• 700 1_ |a Cao, Liqiang |9 (曹立强)

• 700 1_ |a Liu, Fengman |9 (刘丰满)

• 700 1_ |a Wang, Qidong |9 (王启东)

• 920 __ |a 242430 |z 1

• 950 __ |a SCNU |f TN4/L366.1