机读格式显示(MARC)
- 010 __ |a 978-7-115-16639-5 |d CNY45.00
- 099 __ |a CAL 012007118623
- 100 __ |a 20071010d2007 em y0chiy50 ea
- 200 1_ |a 半导体制造基础 |A ban dao ti zhi zao ji chu |d = Fundamentals of semiconductor fabrication |f (美) Gary S. May, 施敏著 |g 代永平译 |z eng
- 210 __ |a 北京 |c 人民邮电出版社 |d 2007
- 215 __ |a 268页 |c 图, 肖像 |d 24cm
- 225 2_ |a 图灵电子与电气工程丛书 |A tu ling dian zi yu dian qi gong cheng cong shu
- 305 __ |a 据John Wiley & Sons, Inc.2003年英文版译出.
- 306 __ |a 本书简体中文版由Wiley Publishing, Inc.授权人民邮电出版社出版.
- 410 _0 |1 2001 |a 图灵电子与电气工程丛书
- 500 10 |a Fundamentals of semiconductor fabrication |m Chinese
- 606 0_ |a 半导体工艺 |A ban dao ti gong yi
- 701 _1 |a 梅 |A mei |g (May, Gary S.) |4 著
- 701 _0 |a 施敏 |A shi min |4 著
- 702 _0 |a 代永平 |A dai yong ping |4 译
- 801 _0 |a CN |b BUPT |c 20061010
- 801 _2 |a CN |b SCNU |c 20080217
- 905 __ |a SCNU |f TN305/8069
- 999 __ |M wp |m 20080217 10:44:48 |G wp |g 20080217 14:47:53
- 907 __ |a SCNU |f TN305/8069