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题名/责任者:

Characterization of integrated circuit packaging materials = 集成电路封装材料的表征 / [editors], Thomas M.Moore, Robert G.McKenna.

出版发行项:

Harbin : Harbin Institute of Technology Press, 2014.

ISBN:

9787560342825

载体形态项:

xx, 274 p. : ill. ; 23 cm.

变异题名:

集成电路封装材料的表征

丛编说明:

Materials characterization serise = 材料表征原版系列丛书

附加个人名称:

Moore Thomas M.

附加个人名称:

McKenna, Robert G.

论题主题:

Integrated circuit technology.

中图法分类号:

TN405

书目附注:

Includes bibliographical references and index.

原版附注:

Reprint. Originally published: New York : Momentum Press, 2010. 9781606501870.

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